FR-4 PCB は高温および高周波アプリケーションで使用できますか?

FR-4 PCB is the widely used and most common PCB material in the market. It is made up of woven fiberglass cloth and epoxy resin, which makes it highly robust, rigid, and dimensionally stable. The FR-4 PCB possesses excellent thermal and electrical properties, making it a perfect choice for various applications. Whether it is a low power application or high-frequency circuits, FR-4 PCB can handle it all. The material is cost-effective, readily available, and a versatile material that can provide a solution to a wide range of electronic devices. Below, we'll answer some of the most frequently asked questions about FR-4 PCB.

Can FR-4 PCB withstand high temperatures?

Yes, FR-4 PCB can withstand high temperatures. The glass transition temperature (Tg) of FR-4 PCB is typically around 130 - 180 °C, depending on the type of resin system used. Moreover, an FR-4 PCB with high-temperature laminate can handle even more elevated temperatures - up to 200°C.

Can FR-4 PCB be used in high-frequency applications?

Yes, FR-4 PCB can be used in high-frequency applications. However, choosing the right FR-4 material with a low dielectric constant and loss is critical for high-frequency performance. The dielectric constant of FR-4 PCB ranges from 4.0 to 5.4. The FR-4 PCB with low dielectric constant has excellent impedance control and signal integrity under high-frequency conditions.

What is the maximum frequency that FR-4 PCB can support?

FR-4 PCB can support a maximum frequency range of up to 5 GHz, depending on the thickness of the material and PCB design. However, to ensure proper signal integrity and impedance control, it is crucial to choose the right laminate and design the PCB carefully. In conclusion, FR-4 PCB is an excellent choice for most electronic applications, offering a cost-effective solution. It is a durable material with thermal stability, insulation, and mechanical strength. Whether it is used in consumer electronics or high-end applications, FR-4 PCB has shown its remarkable performance. Hayner PCB Technology Co., Ltd. is a company dedicated to providing top-quality PCB solutions. As one of the leading PCB manufacturers in China, they specialize in FR-4 PCB and other PCB materials production. With over 10 years of experience in PCB manufacturing, Hayner PCB has supplied boards to customers all over the world. Contact their sales team at sales2@hnl-electronic.com to learn more about their services.

Scientific papers on FR-4 PCB:

1. Wu, W. (2016). Study on the Properties of FR-4 Based on the Variation of Fiber Content. Journal of Engineered Fibers and Fabrics, 11(1), 81-85.

2. Yang, J., Lu, Y., Zhang, G., & Song, Y. (2020). Fracture toughness and crack propagation behavior of FR-4 epoxy resin laminates. Materials Today Communications, 24, 101080.

3. Li, Q. A., Shi, J. K., Zhan, H. X., & Sun, F. (2017). Study on the thermal conductivity and flammability properties of EG/APP/IFR/Al(OH) 3/FR-4 composites. Journal of Materials Science: Materials in Electronics, 28(17), 12808-12817.

4. Zhang, Z. P., Lu, X. Y., Wang, B., Wu, Y. Q., & Feng, Y. B. (2018). Three-Dimensional Numerical Simulation of Flow State on PCB Electroplating without Non-Through Hole Metal Pillar Structure. Journal of Materials Science & Technology, 34(1), 167-175.

5. Wang, S., Wang, X., Chen, Y., & Li, X. (2019). Reinforcement Design of FR-4 PCB Board Based on Dynamic Stress Test. Materials Today: Proceedings, 12, 387-392.

6. Jiang, X., Zhang, J., Yan, W., & Zhang, Q. (2020). The influence of residual stress on the delamination of multi-layer printed circuit boards. Engineering Failure Analysis, 117, 104735.

7. Liu, Y., Wang, C., Liu, Z., & Li, Y. (2018). Analysis on the flexural properties of sandwich panel with honeycomb paper core and FRP skin under shock loads. Composite Structures, 182, 576-587.

8. Li, X., Wang, S., Chen, Y., & Zheng, X. (2019). Evaluation of the Mechanical Properties of FR-4 Printed Circuit Boards under Mechanical Shock. Engineering, Technology & Applied Science Research, 9(6), 4857-4861.

9. Zhang, Q., Li, P., Liu, X., & Li, Y. (2018). Delamination analysis of printed circuit boards using the extended finite element method. Materials, 11(8), 1377.

10. Yan, J., Li, L., & Zheng, G. (2019). Theoretical and Experimental Analysis of Stripping Forces in Thermal Debonding of Copper-Clad Laminates. Nanomaterials, 9(8), 1083.